PCB Etching Machine | Printed Circuit Board Etching Equipment

Chemcut has been a leader in the PCB etching process since 1957.

Throughout our history, we have used the concept of continuous improvement to ensure our etchers and other wet processing machines are designed and built to ensure their quality, reliability, and longevity. Our dedication to continuous improvement means we are always striving to outdo ourselves.

Along with thin material transport, we have improved our etch uniformity continuously. If you’re using a Chemcut etcher, you are able to etch 2 mil line and space with no issue.

If you desire to etch a line and space smaller than 2 mils, thinner copper is required. The thinner the copper you etch the smaller the etched line and space can be.

Need even better uniformity?

Chemcut has you covered with our patented Intermittent Spray and Etch Adjust Module.

The Intermittent Spray eliminates the puddling effect by giving extra etch to the middle of the panel, flattening the etch uniformity front to back.

Etch Adjust Module is for those small side-to-side hot spots you sometimes have. This is a popular option for plated boards where the thickness can vary from side to side.

On top of our thin material transport and etch uniformity and accuracy, Chemcut pulls away from the pack with our extra engineering options:

Do you prefer to control the spray pressure of every spray tube or zone (depends on setup) instead of the options above?

Then check out our XLi High-Resolution etcher. This module allows you to control the spray pressure of every spray tube or zone from your PLC.

We have designed our the XLi High-Resolution etcher to have five zones—top and bottom—where you can control the pressure of each spray tube or zone. The etcher will allow you to even the etch side to side for PCB fabrication and will allow you to etch one side more than the other without getting in the etch chamber to make adjustments.
One of the most popular money-saving options is our Regeneration system. For cupric chloride, Chemcut’s regeneration system makes the chemistry last indefinitely! The regeneration system will automatically add hydrochloric acid and sodium chlorate as you etch more copper. We also offers a chlorine gas regeneration system for cupric chloride etching.

15″
20″
30″

Cleaner (Stand Alone)
Alkaline Clean to Acid Clean
Custom Size (1 to as many chambers as you want)

Acid Cleaner
Alkaline Cleaner

15″
20″
30″

Custom Size (1 to as many chambers as you want)
Developer (Stand Alone)
DES (Develop – Etch – Strip)

1% Potassium Carbonate
1% Sodium Carbonate

dry film photoresists
liquid photoresists
Aqueous solder mask resist (dry and liquid)
And many more resists

15″
20″
30″
40″

Stand-alone drying system
Portable unit (move anywhere in the shop) or fix it in place

15″
20″
30″

Custom Size (1 to as many chambers as you want)
DES (Develop – Etch – Strip)
Etcher (Stand Alone)
SES (Strip – Etch – Strip)

Alkaline Etchant
Cupric Chloride Etchant
Ferric chloride Etchant
Hydrofluoric Acid (HF)
Micro etch

Aluminum
Copper
Glass
Steel
Titanium
And more

15″
20″
30″

Custom Size (1 to as many chambers as you want)
DES (Develop – Etch – Strip)
SES (Strip – Etch – Strip)
Stripper (Stand Alone)

Metal Resist Stripper
Proprietary Aqueous or Semi-Aqueous Stripper
Potassium Hydroxide
Sodium Hydroxide

20″
30″
40″
50″
60″

Cleaner (Stand Alone)
Alkaline Clean to Acid Clean
Custom Size (1 to as many chambers as you want)

Acid Cleaner
Alkaline Cleaner

20″
30″
40″
50″
60″

Custom Size (1 to as many chambers as you want)
Developer (Stand Alone)
DES (Develop – Etch – Strip)

1% Potassium Carbonate
1% Sodium Carbonate

20″
30″
40″
50″
60″

Custom Size (1 to as many chambers as you want)
DES (Develop – Etch – Strip)
Etcher (Stand Alone)
SES (Strip – Etch – Strip)

Alkaline Etchant
Cupric Chloride Etchant
Ferric chloride Etchant
Hydrofluoric Acid (HF)
Micro etch

Aluminum
Copper
Glass
Steel
Titanium
And more

20″
30″
40″
50″
60″

Custom Size (1 to as many chambers as you want)
DES (Develop – Etch – Strip)
SES (Strip – Etch – Strip)
Stripper (Stand Alone)

Metal Resist Stripper
Proprietary Aqueous or Semi-Aqueous Stripper
Potassium Hydroxide
Sodium Hydroxide

Control the spray pressure of each spray tube using the PLC instead of the throttling screw.

20″
30″
40″
50″
60″

Custom Size (1 to as many chambers as you want)
DES (Develop – Etch – Strip)
Etcher (Stand Alone)
SES (Strip – Etch – Strip)

Alkaline Etchant
Cupric Chloride Etchant
Ferric chloride Etchant
Hydrofluoric Acid (HF)
Micro etch

Aluminum
Copper
Glass
Steel
Titanium
And more

2 oscillating brushes
Built-in Rinse and Dryer

Post PCB drilling
Post punching operations

Single-sided abrasive brush
Tough reinforced conveyor belt supports small parts

Removes these from rinse water: Metal fines, Brush particles, Oils and other contaminates.

Wet Brushing
Oscillating Brushes
Choice of bristle or compressed brushes

Brushing
Cleaner
Finishing
Remove Polishing

Product Lines for Electrolytic and Electroless Plating: CC8000, Dip Tanks, XLi, 2300 Series

Desmear
Electroless Copper Plating
Electroless Nickel Plating
Electrolytic Copper Plating
Electrolytic Gold Plating
Electrolytic Silver Plating
Electrolytic Tin Plating
Immersion Gold Plating
Immersion Silver Plating
Immersion Tin Plating
Ni/Au Plating
PTH (Plated through-hole) Any discussion on this topic should include your chemistry supplier as well. It is critical that the bath for PTH is monitored closely.
Inner layer bonding operations: brown oxide (Bondfilm, Multibond, etc.), (white ‘oxide’ – immersion Tin)