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Conveyorized Chemical Glass Etching and Cleaning Equipment

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How Do You Etch Glass?

Glass etching—silicon etching, Si etching—can be completed chemically, mechanically, or with a laser. Chemcut specializes in building chemical glass etching machines. 

Chemical etching can result in a clear, see-through surface or a frosted, matte finish. 

Etching glass for a see-through surface is completed using HF plus another acid. If you need to remove some material but keep the optical properties, then chemical etching is a great solution for glass thinning. 

Creating decorative glass through chemical engraving is a fast and cost-effective solution. You can utilize a glass frosting solution to engrave the pattern into the surface for a matte finish or an HF etching solution to engrave grooves. 

There are many chemical formulas for glass etching. The most common glass etching solutions we see are: 

  • HF and Nitric acid (Glass Etcher) 
  • HF and sulfuric acid (Glass Etcher) 
  • HF and Ammonium Fluoride (Glass Frosting) 
  • Ammonium Bifluoride (Glass Frosting) 

Advantages of Chemical Glass Etching

Etching to Strengthen: Etching increases the strength of glass by removing the external layer, which is weakened by defects.  

Micro-cracks are common issues with mechanical and laser etching, but not with chemical etching. Chemical etching removes or “rounds out” micro-cracks, significantly lowering crack propagation. 

No chipping along the etched surface and non-etched surface. 

Unlimited complexity: All features are etched at the same time, so there is no added machining cost to produce more complex parts. 

Fast Machining Process: Glass etching may be slow relative to metal etching, but it is fast relative to laser and mechanical machining. Laser and mechanical machining can only make one part at a time, so it is much slower than chemical etching. 

No expensive hard tooling: Since the tooling process is digital, prototyping and design changes are fast and easy. 

Our wet processing equipment is ideal for a variety of glass manufacturing projects—flat panel displays (FPD), cell phones, large frosted windows, small frosted parts, solar panel silicon cleaning or etching, and others. 

The flexibility of our XLi, CC8000, and 2300 Series allows equipment for glass products to be built with a broad range of process steps, dwell times, and rinsing configurations. 

Compared to heavy steel components, Chemcut’s lightweight conveyor construction reduces the possibility of damage to thin glass substrates. Standard conveyor configurations can accommodate piece sizes from 5–60 inches wide and 6–80+ inches long 

Chemcut Wet Processing Equipment for a Range of Glass Projects 

Chemcut has manufactured equipment for a variety of specialized glass processes:  

Chemcut Wet Processing Equipment for a Range of Glass Projects 

Glass Cleaning Machine

  • Chemical Glass Cleaner
  • Mechanical Glass Cleaner

Glass Etcher

  • HF Etcher
  • Glass Thinning
  • Glass Frosting Machine

Glass Photoresist developer

 

Glass Photoresist Stripper

View Commonly Used Wet Processing Machines for Glass and Flat Panel Display Manufacturing  

XLi with External Automatic Pressure Adjust
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Control the spray pressure of each spray tube using the PLC instead of the throttling screw.

Available Conveyor Widths
  • 20″
  • 30″
  • 40″
  • 50″
  • 60″
Common Processes
  • Custom Size (1 to as many chambers as you want)
  • DES (Develop – Etch – Strip)
  • Etcher (Stand Alone)
  • SES (Strip – Etch – Strip)
Common Chemicals
  • Alkaline Etchant
  • Cupric Chloride Etchant
  • Ferric chloride Etchant
  • Hydrofluoric Acid (HF)
  • Micro etch
Common Materials Etched
  • Aluminum
  • Copper
  • Glass
  • Steel
  • Titanium
  • And more
XLi Developing Systems
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Available Conveyor Widths
  • 20″
  • 30″
  • 40″
  • 50″
  • 60″
Common Processes
  • Custom Size (1 to as many chambers as you want)
  • Developer (Stand Alone)
  • DES (Develop – Etch – Strip)
Common Chemicals
  • 1% Potassium Carbonate
  • 1% Sodium Carbonate
XLi Etching Systems
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Available Conveyor Widths
  • 20″
  • 30″
  • 40″
  • 50″
  • 60″
Common Processes
  • Custom Size (1 to as many chambers as you want)
  • DES (Develop – Etch – Strip)
  • Etcher (Stand Alone)
  • SES (Strip – Etch – Strip)
Common Chemicals
  • Alkaline Etchant
  • Cupric Chloride Etchant
  • Ferric chloride Etchant
  • Hydrofluoric Acid (HF)
  • Micro etch
Common Materials Etched
  • Aluminum
  • Copper
  • Glass
  • Steel
  • Titanium
  • And more
XLi Chemical Cleaning System
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Available Conveyor Widths
  • 20″
  • 30″
  • 40″
  • 50″
  • 60″
Common Processes
  • Cleaner (Stand Alone)
  • Alkaline Clean to Acid Clean
  • Custom Size (1 to as many chambers as you want)
Common Chemicals
  • Acid Cleaner
  • Alkaline Cleaner
XLi Stripping Systems
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Available Conveyor Widths
  • 20″
  • 30″
  • 40″
  • 50″
  • 60″
Common Processes
  • Custom Size (1 to as many chambers as you want)
  • DES (Develop – Etch – Strip)
  • SES (Strip – Etch – Strip)
  • Stripper (Stand Alone)
Common Chemicals
  • Metal Resist Stripper
  • Proprietary Aqueous or Semi-Aqueous Stripper
  • Potassium Hydroxide
  • Sodium Hydroxide
2300 Series Chemical Cleaning System
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Available Conveyor Widths
  • 15″
  • 20″
  • 30″
Common Processes
  • Cleaner (Stand Alone)
  • Alkaline Clean to Acid Clean
  • Custom Size (1 to as many chambers as you want)
Common Chemicals
  • Acid Cleaner
  • Alkaline Cleaner
2300 Series Developing System
image
Available Conveyor Widths
  • 15″
  • 20″
  • 30″
Common Processes
  • Custom Size (1 to as many chambers as you want)
  • Developer (Stand Alone)
  • DES (Develop – Etch – Strip)
Common Chemicals
  • 1% Potassium Carbonate
  • 1% Sodium Carbonate
Common Resists
  • dry film photoresists
  • liquid photoresists
  • Aqueous solder mask resist (dry and liquid)
  • And many more resists
2300 Series Dryer
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Available Conveyor Widths
  • 15″
  • 20″
  • 30″
  • 40″
Features
  • Stand-alone drying system
  • Portable unit (move anywhere in the shop) or fix it in place
2300 Series Etching System
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Available Conveyor Widths
  • 15″
  • 20″
  • 30″
Common Processes
  • Custom Size (1 to as many chambers as you want)
  • DES (Develop – Etch – Strip)
  • Etcher (Stand Alone)
  • SES (Strip – Etch – Strip)
Common Chemicals
  • Alkaline Etchant
  • Cupric Chloride Etchant
  • Ferric chloride Etchant
  • Hydrofluoric Acid (HF)
  • Micro etch
Common Materials Etched
  • Aluminum
  • Copper
  • Glass
  • Steel
  • Titanium
  • And more
2300 Series Stripping System
image
Available Conveyor Widths
  • 15″
  • 20″
  • 30″
Common Processes
  • Custom Size (1 to as many chambers as you want)
  • DES (Develop – Etch – Strip)
  • SES (Strip – Etch – Strip)
  • Stripper (Stand Alone)
Common Chemicals
  • Metal Resist Stripper
  • Proprietary Aqueous or Semi-Aqueous Stripper
  • Potassium Hydroxide
  • Sodium Hydroxide
CC8000 Chemical Cleaning System
image
Available Conveyor Widths
  • 20″
  • 30″
  • 40″
  • 50″
  • 60″
Common Processes
  • Cleaner (Stand Alone)
  • Alkaline Clean to Acid Clean
  • Custom Size (1 to as many chambers as you want)
Common Chemicals
  • Acid Cleaner
  • Alkaline Cleaner
CC8000 Developing Systems
image
Available Conveyor Widths
  • 20″
  • 30″
  • 40″
  • 50″
  • 60″
Common Processes
  • Custom Size (1 to as many chambers as you want)
  • Developer (Stand Alone)
  • DES (Develop – Etch – Strip)
Common Chemicals
  • 1% Potassium Carbonate
  • 1% Sodium Carbonate
Common Resists
  • dry film photoresists
  • liquid photoresists
  • Aqueous solder mask resist (dry and liquid)
  • And many more resists
CC8000 Etching Systems
image
Available Conveyor Widths
  • 20″
  • 30″
  • 40″
  • 50″
  • 60″
Common Processes
  • Custom Size (1 to as many chambers as you want)
  • DES (Develop – Etch – Strip)
  • Etcher (Stand Alone)
  • SES (Strip – Etch – Strip)
Common Chemicals
  • Alkaline Etchant
  • Cupric Chloride Etchant
  • Ferric chloride Etchant
  • Hydrofluoric Acid (HF)
  • Micro etch
Common Materials Etched
  • Aluminum
  • Copper
  • Glass
  • Steel
  • Titanium
  • And more
CC8000 Stripping Systems
image
Available Conveyor Widths
  • 20″
  • 30″
  • 40″
  • 50″
  • 60″
Common Processes
  • Custom Size (1 to as many chambers as you want)
  • DES (Develop – Etch – Strip)
  • SES (Strip – Etch – Strip)
  • Stripper (Stand Alone)
Common Chemicals
  • Sodium Hydroxide
  • Potassium Hydroxide
  • Proprietary Aqueous or Semi-Aqueous Stripper
  • Metal Resist Stripper
121 Brush Cleaner
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Features
  • Wet Brushing
  • Oscillating Brushes
  • Choice of bristle or compressed brushes
Common uses
  • Brushing
  • Cleaner
  • Finishing
  • Remove Polishing
219 Scrubber
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Features
  • Single-sided abrasive brush
  • Tough reinforced conveyor belt supports small parts
990D Electroless Plating System
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Product Lines for Electrolytic and Electroless Plating: CC8000, Dip Tanks, XLi, 2300 Series

Common Processes
  • Desmear
  • Electroless Copper Plating
  • Electroless Nickel Plating
  • Electrolytic Copper Plating
  • Electrolytic Gold Plating
  • Electrolytic Silver Plating
  • Electrolytic Tin Plating
  • Immersion Gold Plating
  • Immersion Silver Plating
  • Immersion Tin Plating
  • Ni/Au Plating
  • PTH (Plated through-hole) Any discussion on this topic should include your chemistry supplier as well. It is critical that the bath for PTH is monitored closely.
  • Inner layer bonding operations: brown oxide (Bondfilm, Multibond, etc.), (white ‘oxide’ – immersion Tin)

Related Resources

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